The main function of the patch terminal

The main function of the patch terminal

Protect the thin chemical copper just deposited to prevent it from being etched by acid, and thicken it to a certain extent through electroplating. Provide sufficient conductivity, thickness and prevent heating and mechanical defects in the conductive circuit.

Process parameters for copper electroplating of patch terminals: The main components of the bath are copper sulfate and sulfuric acid. A high-acid, low-copper formula is used to ensure the uniformity of the thickness distribution of the board surface during electroplating and the deep plating ability of deep holes; the sulfuric acid content is mostly between 180 and 240 g/L; the copper sulfate content is generally around 75 g/L, and there may be trace amounts of chloride ions in the bath, which serve as auxiliary gloss agents and copper light agents to jointly exert the gloss effect; the amount of copper light agent added is 3~5mI, and the addition of copper light agent is generally supplemented according to the kiloampere-hour method or according to the actual production board effect; the current for full-board electroplating is generally calculated as 2 amperes/square decimeter multiplied by the electroplatable area on the board; the temperature of the copper cylinder is generally controlled at 22~32 degrees.

Patch terminals can also be plated with copper, nickel, gold, palladium nickel, tin-lead, silver, etc. Different coatings have different performance characteristics.